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TIC225 SERIES SILICON TRIACS
Copyright (c) 1997, Power Innovations Limited, UK JULY 1975 - REVISED MARCH 1997
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Sensitive Gate Triacs 8 A RMS, 70 A Peak Glass Passivated Wafer 400 V to 800 V Off-State Voltage Max IGT of 5 mA (Quadrant 1)
MT1 MT2 G
1 2 3 TO-220 PACKAGE (TOP VIEW)
Pin 2 is in electrical contact with the mounting base.
MDC2ACA
absolute maximum ratings over operating case temperature (unless otherwise noted)
RATING TIC225D Repetitive peak off-state voltage (see Note 1) TIC225M TIC225S TIC225N Full-cycle RMS on-state current at (or below) 70C case temperature (see Note 2) Peak on-state surge current full-sine-wave (see Note 3) Peak on-state surge current half-sine-wave (see Note 4) Peak gate current Peak gate power dissipation at (or below) 85C case temperature (pulse width 200 s) Average gate power dissipation at (or below) 85C case temperature (see Note 5) Operating case temperature range Storage temperature range Lead temperature 1.6 mm from case for 10 seconds IT(RMS) ITSM ITSM IGM PGM PG(AV) TC Tstg TL VDRM SYMBOL VALUE 400 600 700 800 8 70 80 1 2.2 0.9 -40 to +110 -40 to +125 230 A A A A W W C C C V UNIT
NOTES: 1. These values apply bidirectionally for any value of resistance between the gate and Main Terminal 1. 2. This value applies for 50-Hz full-sine-wave operation with resistive load. Above 70C derate linearly to 110C case temperature at the rate of 200 mA/C. 3. This value applies for one 50-Hz full-sine-wave when the device is operating at (or below) the rated value of on-state current. Surge may be repeated after the device has returned to original thermal equilibrium. During the surge, gate control may be lost. 4. This value applies for one 50-Hz half-sine-wave when the device is operating at (or below) the rated value of on-state current. Surge may be repeated after the device has returned to original thermal equilibrium. During the surge, gate control may be lost. 5. This value applies for a maximum averaging time of 20 ms.
electrical characteristics at 25C case temperature (unless otherwise noted)
PARAMETER IDRM Repetitive peak off-state current Peak gate trigger current VD = rated VDRM Vsupply = +12 V IGTM Vsupply = +12 V Vsupply = -12 V Vsupply = -12 V Vsupply = +12 V VGTM Peak gate trigger voltage Vsupply = +12 V Vsupply = -12 V Vsupply = -12 V All voltages are with respect to Main Terminal 1. TEST CONDITIONS IG = 0 RL = 10 RL = 10 RL = 10 RL = 10 RL = 10 RL = 10 RL = 10 RL = 10 TC = 110C tp(g) > 20 s tp(g) > 20 s tp(g) > 20 s tp(g) > 20 s tp(g) > 20 s tp(g) > 20 s tp(g) > 20 s tp(g) > 20 s 0.8 -4.5 -3.5 11.7 0.7 -0.7 -0.8 0.9 MIN TYP MAX 2 5 -20 -10 30 2 -2 -2 2 V mA UNIT mA
PRODUCT
INFORMATION
Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters.
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TIC225 SERIES SILICON TRIACS
JULY 1975 - REVISED MARCH 1997
electrical characteristics at 25C case temperature (unless otherwise noted) (continued)
PARAMETER VTM IH IL dv/dt dv/dt(c) Peak on-state voltage Holding current Latching current Critical rate of rise of off-state voltage Critical rise of commutation voltage ITM = 12 A Vsupply = +12 V Vsupply = -12 V Vsupply = +12 V Vsupply = -12 V VDRM = Rated VDRM VDRM = Rated VDRM TEST CONDITIONS IG = 50 mA IG = 0 IG = 0 (see Note 7) IG = 0 ITRM = 12 A TC = 110C TC = 70C 1 50 1.5 4.5 (see Note 6) Init' ITM = 100 mA Init' ITM = -100 mA MIN TYP 1.6 3 -4.7 MAX 2.1 20 -20 30 -30 UNIT V mA mA V/s V/s
All voltages are with respect to Main Terminal 1. NOTES: 6. This parameter must be measured using pulse techniques, tp = 1 ms, duty cycle 2 %. Voltage-sensing contacts separate from the current carrying contacts are located within 3.2 mm from the device body. 7. The triacs are triggered by a 15-V (open-circuit amplitude) pulse supplied by a generator with the following characteristics: RG = 100 , tp(g) = 20 s, tr = 15 ns, f = 1 kHz
thermal characteristics
PARAMETER RJC RJA Junction to case thermal resistance Junction to free air thermal resistance MIN TYP MAX 2.5 62.5 UNIT C/W C/W
TYPICAL CHARACTERISTICS
GATE TRIGGER CURRENT vs CASE TEMPERATURE
1000 Vsupply IGTM IGT - Gate Trigger Current - mA + + + +
TC07AA
GATE TRIGGER VOLTAGE vs CASE TEMPERATURE
10 Vsupply IGTM VGT - Gate Trigger Voltage - V + + + +
TC07AB
VAA = 12 V RL = 10 tp(g) = 20 s
VAA = 12 V RL = 10 tp(g) = 20 s
}
100
10
1
1
0*1 -60
-40
-20
0
20
40
60
80
100
120
0*1 -60
-40
-20
0
20
40
60
80
100
120
TC - Case Temperature - C
TC - Case Temperature - C
Figure 1.
Figure 2.
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INFORMATION
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TIC225 SERIES SILICON TRIACS
JULY 1975 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
HOLDING CURRENT vs CASE TEMPERATURE
100 Vsupply VGF - Gate Forward Voltage - V IH - Holding Current - mA + 10
TC07AD
GATE FORWARD VOLTAGE vs GATE FORWARD CURRENT
10
TC07AC
1
1 VAA = 12 V IG = 0 Initiating ITM = 100 mA 0*1 -60 -40 -20 0 20 40 60 80 100 120
0*1
IA = 0 TC = 25 C QUADRANT 1 0*01 0*0001 0*001
0*01
0*1
1
TC - Case Temperature - C
IGF - Gate Forward Current - A
Figure 3. LATCHING CURRENT vs CASE TEMPERATURE
100 Vsupply IGTM IL - Latching Current - mA + + + + VAA = 12 V
TC07AE
Figure 4.
SURGE ON-STATE CURRENT vs CYCLES OF CURRENT DURATION
100 ITSM - Peak Full-Sine-Wave Current - A
TI07AA
TC 70C
10
10
No Prior Device Conduction Gate Control Guaranteed
1 -60
-40
-20
0
20
40
60
80
100
120
1 1 10 100 1k Consecutive 50-Hz Half-Sine-Wave Cycles
TC - Case Temperature - C
Figure 5.
Figure 6.
PRODUCT
INFORMATION
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TIC225 SERIES SILICON TRIACS
JULY 1975 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
MAXIMUM RMS ON-STATE CURRENT vs CASE TEMPERATURE
10 IT(Rms) - Maximum On-State Current - A 9 8 7 6 5 4 3 2 1 0 0 25 50 75 100 125 150 TC - Case Temperature - C
TI07AB
Figure 7.
PARAMETER MEASUREMENT INFORMATION
VAC VAC
L1
ITRM IMT2 C1 50 Hz IMT2 VMT2 DUT RG R1 IG See Note A VMT2 dv/dt 63% IG NOTE A: The gate-current pulse is furnished by a trigger circuit which presents essentially an open circuit between pulses. The pulse is timed so that the off-state-voltage duration is approximately 800 s. 10% VDRM
Figure 8.
PMC2AA
PRODUCT
INFORMATION
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TIC225 SERIES SILICON TRIACS
JULY 1975 - REVISED MARCH 1997
MECHANICAL DATA TO-220 3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
TO220 4,70 4,20
o
3,96 3,71
10,4 10,0
2,95 2,54 6,6 6,0 15,90 14,55
1,32 1,23
see Note B
see Note C
6,1 3,5
0,97 0,61 1 2 3
1,70 1,07
14,1 12,7
2,74 2,34 5,28 4,88 2,90 2,40
0,64 0,41
VERSION 1
VERSION 2
ALL LINEAR DIMENSIONS IN MILLIMETERS NOTES: A. The centre pin is in electrical contact with the mounting tab. B. Mounting tab corner profile according to package version. C. Typical fixing hole centre stand off height according to package version. Version 1, 18.0 mm. Version 2, 17.6 mm. MDXXBE
PRODUCT
INFORMATION
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TIC225 SERIES SILICON TRIACS
JULY 1975 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements. PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright (c) 1997, Power Innovations Limited
PRODUCT
INFORMATION
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